The influence of the solder joint void on the CCGA package reliability

摘要：

　　Ceramic column grid array(CCGA)package is an extension of the ceramic ball grid array(CBGA)package.The CCGA uses a column instead of a high melt ball to create a higher standoff and more flexible interconnect,and to achieve a significant increase in reliability.The void of the solder joint has a significant influence on the CCGA package reliability.This paper introduced two reflow processes of CCGA717 package(N2 and vacuum atmosphere),it specifically discussed the solder joint strength,board-level reliability of the CCGA package.By design of the daisy-chain substrate,the board-level reliability of the CCGA packages were investigated.This study showed that with the low void rate(<5%),the CCGA solder joint will get a high joint strength and high board-level reliability.

作者: Yingzhuo Huang Binhao Lian Quanbin Yao Xiaorui Lv Pengrong Lin

作者单位: Beijing Microelectronics Technology Institute Beijing,100076,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 850-853

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）