会议专题

第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

总文献量: 179篇会议类型: 国际会议会议地点: 上海主办单位: 中国电子学会;中国半导体行业协会会议日期: 2007-08-14

文章浏览

Effect of Vacuum Environments on Performance and Reliability of Electronic Components and Packages for Space Applications

Ashok Sharma Alexander Teverovsky

Preparation and Properties of Sn-9Zn-3Bi-Cr Based Lead-free Solder

Qi Li Anmin Hu Ming Li Dali Mao

Predicting the Reliability of Electronic Products

Jie Gu Michael Pecht

Design and simulation of the Positioning System Using Computer Vision for IC Packaging

Junlan Li Yizhong Wang Dawei Zhang Xingyu Zhao

Enhancing Signal Quality of Evanescent-Wave Multimode Fiber Optic Sensor Using Diffuse Excitation Light

Jianjun Ma Wojtek J.Bock

Effects of Packaging Materials on the Reliability of System in Package

Shan Gao Jupyo Hong Jinsu Kim Seogmoon Choi Sung Yi

Oxidation Behavior and Intermetallic Compounds Growth of Sn-Ag-Bi-Cr Lead-free Solder

Huan Wang Anmin Hu Chengkang Chang Ming Li Dali Mao

Optimal Design of SnAgCu-CNT Solder Lap-shear Specimen under Thermal Cycles with FEM

Yongdian Han Hongyang Jing Lianyong Xu Jun Wei

Fatigue Behavior of BGA Soldering under Board Level Drop Test

Bo Qi Pingyue Fan Jiaji Wang

Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects

Auersperg Juergen Matthias Klein Bernd Michel

The Synthesis of Liquid Crystalline Epoxy Resin and Its Application in Large-scale Integrated Circuits Packaging

Mingshan Yang Jie He Linkai Li Wenyu Xu

A New In-process Measurement Method for Wafer Surface Roughness

Ruipeng Guo Zhengsu Tao

Design of MEMS Filter for Wimax systems

De-fang Wei Ying-liang Li Ji-de Zhao

Unstable Void Growth in Thermohyperelastic Plastic IC Packaging Material due to Thermal Load and Vapor Pressure

Zhigang Li Xiaoyan Niu Xuefeng Shu

Effects of Thermo-Mechanical Stress in Solder Joints under High Current Stressing

Jinsong Zhang Yiping Wu Hongjia Xi Bing An Fengshun Wu

Aluminum Ribbon Bonding Technology in a New Package of High Power and Thermal Performance

Huiliang Zhang Hongbo Yang Ming Zhou Anthony C.Tsui

Thermal Profiling to Overcome Flux Residue Formation in a No-clean Solder Paste for Lead-free Surface Mount Technology

Leah Buenaflor Sheila Liza Dal Ian Estinozo

A Hybrid Optimization Approach of Max-Min Ant System and Adaptive Genetic Algorithm for MCM Interconnect Test Generation

Chen Lei

The Components Layout Optimization of Circuit Module Based on the Artificial Nerve Network

Hong-yan Huang De-jian Zhou Zhao-hua Wu

Study on Leak Rate Formula and Criterion for Helium Mass Spectrometer Fine Leak Test

Wang Geng-lin Wang Li-yan Dong Li-Jun Huang Zheng