The Synthesis of Liquid Crystalline Epoxy Resin and Its Application in Large-scale Integrated Circuits Packaging

摘要：

MEP(mono-functional epoxy group prepolymer) was prepared through reacting biphenol with epichlorohydrin, and the structure were dete rmined by FTIR、 XRD and polarizing microscope. Epoxy molding composite(EMC) used for the packaging of ultra-large-scale integrated circuit (IC) was prepared by mixing the liquid crystalline epoxy resin with ortho-cresol novolac epoxy(ECN) using high-speed premixing and twin roller mixing and the better formulation and process parameters had been obtained in this paper. The results have shown that the EMC has the ordered domain of liquid crystalline structure.

作者: Mingshan Yang Jie He Linkai Li Wenyu Xu

作者单位: Department of Material Science and Engineering, Beijing Institute of Petrochemical Technology, Beiji College of Material Science and Engineering, Beijing University of Chemical Technology, Beijing 1000 Guangdong Rongtai Industry Co., Ltd., Jieyang, Guangdong 522000, China Department of Material Science and Engineering, Beijing Institute of Petrochemical Technology, Beiji

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 282-285

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）