Fatigue Behavior of BGA Soldering under Board Level Drop Test
It was studied in the paper the fatigue behavior of the BGA Leaded and lead-free soldering under board level drop test. The life of soldering in drop test was measured and the crack extending inside the soldering was considered as the root cause of the failure. The initiation and propagation of soldering cracks were characterized using Fluorescence-Dye Method. And result shows crack extending rate of Lead component is larger than that of lead-free component. The principle of crack propagating and extending under this circumstance were analyzed and discussed for the better understanding the failure cause and mechanism of the BGA soldering.
Bo Qi Pingyue Fan Jiaji Wang
Fudan-Samsung Packaging Reliability Joint Lab, Fudan University, Shanghai, China Samsung Semiconductor China R&D Co.,Ltd, Suzhou, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
748-751
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）