Aluminum Ribbon Bonding Technology in a New Package of High Power and Thermal Performance
To meet the strong market demand for smaller and thinner device with higher power, lower package resistance and higher thermal capability package for power management field, several technical approaches are being researched by IDM companies worldwide. Based on GEMs experience and existing technique for discrete package assembly and testing,GEMPAK5060, a flat leaded package, originated from the SOIC8, has been developed. GEMPAK5060, utilizing the Al ribbon bonding technique, allows smaller dimension and better power performance than SOIC8.This paper presents the advantages of state-of-art ribbon bonding technology on GEMPAK5060 package. Its performance with regard to achieving higher power and lower resistance in power semiconductor package is also discussed.
Huiliang Zhang Hongbo Yang Ming Zhou Anthony C.Tsui
Advanced Engineering Department, GEM Electronics (Shanghai) Co., Ltd.438 Zhaoxian Rd., Jiading Development Industrial Park, Jiading, Shanghai 201821, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
367-369
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）