Effects of Thermo-Mechanical Stress in Solder Joints under High Current Stressing
In a typical solder joint interconnection, it consists of different materials with different physical properties. When the solder joint is under high current stressing to electromigration, substantial Joule heating will increase the temperature to generate thermo-mechanical stress. A 3D FEA is used to investigate effects of the thermal-mechanical stress remaining in different solder joints during the electromigration experiment. Although the symmetrical structure takes a uniform distribution of current density in every solder joint, temperature distribution is still nonuniform due to Joule heating effects. This produces non-homologous distributions of thermo-mechanical stress and strain in different joints. The thermo-mechanical stress derives from the mismatch of Youngs modulus and CTE of different materials. The larger thermo-mechanical stress accumulates in regions where electromigration first occurs, and take the maximum deformation of solder joint there. As a result, the thermal deformation will significantly degrade the reliability of the solder joint interconnection.
Jinsong Zhang Yiping Wu Hongjia Xi Bing An Fengshun Wu
Wuhan National Laboratory for Optoelectronics, State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan 430074, China
国际会议
第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)
上海
英文
627-631
2007-08-14（万方平台首次上网日期，不代表论文的发表时间）