Preparation and Properties of Sn-9Zn-3Bi-Cr Based Lead-free Solder

摘要：

The influence of different Cr content on oxidation resistance, thermal properties, wetting properties, growth of intermetallic compound of Sn-9Zn-3Bi based solder are described herein, and compare with eutectic Sn-9Zn solder. Cr element segregates in the near-surface layer, and improves the oxidation resistance which contributes to better wettability at the meantime. Sn-9Zn-3Bi-0.3Cr solder shows the best oxidation resistance and wetting properties, followed by Sn9Zn-3Bi-0.1Cr solder. Because of its small amount, Cr addition causes little change in solidus and liquidus temperature of Sn-9Zn-3Bi alloy. Micrographs of Sn-9Zn-3Bi-xCr/Cu interfaces indicate that the addition of Cr can obviously restrain growth of IMCs, and Sn-9Zn-3Bi-0.3Cr alloy has the thinnest thickness of IMCs.

作者: Qi Li Anmin Hu Ming Li Dali Mao

作者单位: Lab of Microelectronic Materials & Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 452-455

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）