Unstable Void Growth in Thermohyperelastic Plastic IC Packaging Material due to Thermal Load and Vapor Pressure

摘要：

In this paper, a representative material cell containing a single microvoid is used to investigate void growth under combined vapor pressure and thermal stress. The plastic IC packaging material is assumed to be Gent-Thomas thermohyperelastic materials. Using the theory of cavity formation and unstable void growth in incompressible hyper-elastic material, we gained an analytical relation between the applied traction and the change of temperature.Numerical analysis is given of such polymers Electronic Packaging Materials occurred Popcorn critical load burst.Numerical results indicate that the critical stress for unstable void growth is very sensitive to the change of temperature.The critical stress for unstable void growth at reflow temperature is likely to be much lower than that at room temperature.

作者: Zhigang Li Xiaoyan Niu Xuefeng Shu

作者单位: Institute of Applied Mechanics, Taiyuan University of Technology No.79 West Yingze Street, Taiyuan 030024, Shanxi, PR China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 390-392

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）