Design and simulation of the Positioning System Using Computer Vision for IC Packaging

摘要：

A positioning system using computer vision technologies is designed to obtain high precision during wire bonding. The main processes are on-line examining the position of a chip before bonding, calculating its locating errors, and cooperating with control system to eliminate these errors.Therefore, chips accurate positions can be obtained which can improve the technology of wire bonding. A novel optical imaging system is designed to get images with high quality.Micro-imaging system consists of two lenses to achieve appropriate magnifying multiple and working distance, which are 4 and distance is 47mm, respectively. Illumination lens provides steady and symmetrical lighting condition on working area. Normalized correlation image registration algorithm is applied as the pattern recognition positioning algorithm of wire bonders vision system. Some simulation experiments have been carried out, which show that the precision of pattern recognition in this system is 3.5μm, which satisfies the requirements of wire bonding.

作者: Junlan Li Yizhong Wang Dawei Zhang Xingyu Zhao

作者单位: Department of Mechanical Engineering, Tianjin University, Tianjin 300072, China

会议类型: 国际会议

会议名称: 第八届电子封装技术国际会议(2007 8th International Conference on Electronics Packaging Technology ICEPT2007)

会议地点: 上海

会议语种:英文

页码: 478-481

在线出版日期: 2007-08-14（万方平台首次上网日期，不代表论文的发表时间）