University Education Program on Microelectronics Packaging and Assembly: Facing the Challenging of Fast Developing Electronics Industry
A Preliminary EBSD Study of Microstructures and Microtextures Evolution during Au Stud and Flip-chip Thermosonic Bonding
Prediction of Micro Pitch Motion of a Microsensor Component during Laser Soldering Interconnection Process
Passivation Cracking Analyses of ICs for Different Fixing Position under the Aeronautical Working Conditions
Coupling effect between two pads in Ni(Au/Ni/Cu)-SnAg-Cu sandwich solder joints during reflow and thermal aging
The Innovative Research of Integrating Temperature-Controlling Microcirculation System into Three-Dimensional Circuit