Microstructures transformation in Sn-base solders under the isothermal and thermal-shearing cycling condition
Experimental Testing and Failure Prediction of PBGA Package Assemblies under 3-Point Bending Condition through Computational Stress Analysis
Numerical and Experimental Study on Solder Joint Self-Alignment Behavior for Optical Fiber Attachment Assembly
Advanced Manufacturing Technologies and characterization of the Microelectronic Interconnect and Packaging Materials
Simulation and Testing of Multi-channel Electron Multiplier Using LTCC/Thick Silver Cofired Structures