会议专题

第七届电子封装技术国际会议（2006 7th International Conference on Electronics Packaging Technology）

总文献量: 200篇会议类型: 国际会议会议地点: 上海主办单位: 中国电子学会;中国半导体行业协会会议日期: 2006-08-26

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Board level drop test reliability for MCP package

Green IC Packages Certification

Design of A Novel Micro Thermo-Fluidic Gyroscope

Study on the Board Level Reliability of Lead-free PBGA Packages

An Experimental-Numerical Study of Metal Peel Off in Cu/low-k Back-End Structures

Effect of the Properties of Gold Wire on the Ability of Low-looped Wire Bonding

Study on Bonding Interface Vibration of Thermosonic Flip Chip

Galvanic Effect on Wet etching of Stacking Structure

Study on the Reliability of Capacitive Shunt RF MEMS Switch

Investigation of tin atomic migration of tin-based solders with cluster model and DV-Xα method in electromigration

Finite Element Analysis of TSOP Silicon Die Crack Issue during Molding Process

Preparation of Conductive Particles by Electroless Nickel Plating on Polystyrene Microsphere

Study on Interconnect Test Generation of MCM based on Particle Swarm Optimization Algorithm

Low-k and High Thermal Stable Fluorinated Epoxy Materials For Advanced Microelectronic Packaging Applications

Simulating analysis of dynamic responses for CSP under board level drop test

Simulation Calculation of Mechanical Performance of Particle Filled Electronic Packaging Polymer

Virtual Prototyping of Advanced Packaging

Thermal Characters Analysis of induction-self-heating-reflow for solders bumping

The Application of Carbon Nanotubes in CMOS Integrated Circuits

Optimization of 2 mil Al Wire Wedge Bond of D-PAK