会议专题

第七届电子封装技术国际会议（2006 7th International Conference on Electronics Packaging Technology）

总文献量: 200篇会议类型: 国际会议会议地点: 上海主办单位: 中国电子学会;中国半导体行业协会会议日期: 2006-08-26

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Solder Joint Thermal Fatigue Analysis of 48-FBGA

Development of an Internal Liquid Cooling System for CPU using RP Technology

An Integrated Intelligent Insulin Pump

Interfacial characterization and bonding mechanism of ultrasonic wedge bonding

Thermo-Mechanical Virtual Prototyping of Laminate-Based RF System-in-Package modules

Ultra Precision Polishing of GMR Hard-disk Magnetic Head

Impacts of wafer-bow and surface contamination on low temperature wafer direct bonding

RFID Tag Packaging with Anisotropically Conductive Adhesive

Processes Study of MEMS Vacuum Packaging Using Resistance Spot Welding

Mechanical characterization of microelectronics embedded in flexible substrate

Metallurgical Behavior of Au/Al Bond Interface during High Temperature Storage of Ultrasonic Wedge Bonding

Bonding Behaviors of Au-Au and Au-Sn Thin Bumps at Low Temperature

ESD Models and Measurement for Semiconductor Device

A Novel Embedded Capacitor Insulating Composite Material Using Benzoxazine Resin as Polymeric Matrix

Electroless Plating Ni-based Barrier Layers for Silicon Vertical Interconnects

Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System

Analysis of Dark Stain on Chip Surface of High-Power LED

RF Characteristic and Modeling of The RF MEMS Switch Packaging

Effect of Ramp Rate on Microstructure and Properties of Thermomechanically-Fatigued Sn-3.SAg Based Composite Solder Joints

Development on Semiconductor Semiconductor Industry In Shanghai