Effects of Bonding Parameters on the Lighting Performance of High Power LEDs Fabricated by Thermosonic flip chip Bonding
The Microstructure of Eutectic Au-Sn and In-Sn Solders on Au/Ti and Au/Ni Metallizations during Laser Solder Bonding Process for Optical Fiber Alignment
Research on Back-Sealed Technology and its Application in Mass Production of High Resistivity and Thick Epitaxy on Heavily-doped Substrates