Research on Interfacial Intermetallics Growth Behavior of SnAgCu/Cu Solder Joints under Thermal-shearing Cycling
Thermo-mechanical Reliability Study of High I/Os Flip Chip On Stacked-Via Laminated Board Based on Finite Element Analysis (FEA), Response Surface Methodology (RSM) and Interfacial Fracture Mechanics
Solder Joint Failure Modes, Mechanisms, and Life Prediction Models of IC Packages under Board Level Drop Impact
The Diffusion of Ni into Al Wire at the Interface of Ultrasonic Wire Bond During High Temperature Storage
Characterization of Copper-to-Silicon Diffusion for the Application of 3D Packaging with Through Silicon Vias
Parametric Cost Estimating: A Practical Independent Method of Estimating the Manufacturing Cost of Chips to Modules in the Peoples Republic of China
Design and Simulation of a Macro-micro Dual-drive High Acceleration Precision XY-stage for IC Bonding Technology