Analysis of PCB Subassembly Dynamic Responses using Integrated Analytical, Numerical and Experimental Techniques
The Effect of Moisture on the Critical Defect Size For Delamination Failure at the Pad/Encapsulant Interface of Plastic IC Packages Undergoing Solder Reflow
Prediction of Solder Joint geometry for Optical Fiber attachment Assembly in Direct-Coupling Applications
Modeling and Simulation of Thermal-mechanical Characteristics of the Packaging of Tire Pressure Monitoring System (TPMS)