Thermo-mechanical Reliability Study of High I/Os Flip Chip On Stacked-Via Laminated Board Based on Finite Element Analysis (FEA), Response Surface Methodology (RSM) and Interfacial Fracture Mechanics

会议类型: 国际会议

会议名称: 2005 6th International Conference on Electronics Packaging Technology(第六届电子封装国际会议)

会议地点: 深圳

会议语种:英文

页码: 459-465

在线出版日期: 2005-08-30（万方平台首次上网日期，不代表论文的发表时间）