会议专题

2005 6th International Conference on Electronics Packaging Technology(第六届电子封装国际会议)

总文献量: 148篇会议类型: 国际会议会议地点: 深圳主办单位: 中国电子学会;中国半导体行业协会会议日期: 2005-08-30

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Introduction of JIS Related to Lead-free Solder and Soldering

Experiment Study of Temperature Parameter Effect on Bonding Process and Quality in Thermosonic Wire Bonding

Rapid and Selective Induction Heating for Sensor Packaging

The Application of RSM in Optimization of the Curing Profile for Electronic Packaging Polymers

Design and Development of Interconnects for Ultra-Fine Pitch Wafer Level Packages

The Impact of Zincation on the Electroless Nickel UBM for Low Cost Flip Chip Technology

The Influence of Microelement-Ni on Interfacial Reactions Between Lead-free Sn-Ag-Cu and Cu Substrate

Improvements in Au Wire Bondability of Rigid and Flexible Substrates using Plasma Cleaning

System Damping Ratio Analysis of a Capacitive Micromechanical Accelerometer

Characterization of Interfacial Strength as function of Temperature and Moisture Conditions

Oxidation Failure Mechanism of Copper Alloy Lead Frame for IC Package

Surface Activated Bonding -High Density Packaging Solution for Advanced Microelectronic System

Strength Reliability for Surfaces micro-machined Polysilicon Micro-Cantilevers

Experimental Study of Ultrasonic Wedge Bonding with Copper Wire

Simulation Study on Precision Vibration-reduction System for Simulated Work Stage of Lithography

Mechanism and Control of Linear Positioning for IC Wire Bonders

Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application

Study of the Effects of Molding Pressure on the Warpage of HVQFN Packages

Study of MEMS packaging technology

Process Management System Analysis and Design of SMT