会议专题

2005 6th International Conference on Electronics Packaging Technology(第六届电子封装国际会议)

总文献量: 148篇会议类型: 国际会议会议地点: 深圳主办单位: 中国电子学会;中国半导体行业协会会议日期: 2005-08-30

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RELIABILITY ENHANCEMENT OF WAFER LEVEL PACKAGING USING SOLDER BALL LAYOUT METHODOLOGY

Plasma Considerations Prior to Wire Bonding in Advanced Packaging

Effects of Alloying Elements on the Characteristics of Sn-Zn Lead-free Solder

The Formation and Evolution of IMC and Its Effecton the Solder Joint Properties

Energy conversion of nano-cantilever beam with forced vibration in low vacuum housing

Lead-Free Solder Materials for Sustainable Development of Green Electronics

Nano-silver paste with low roasting temperature

Tin Bumping for Wafer Level Lead-free Packaging

Study on Life Distribution of the Elements Based on Rough Function Theory

Microstructure and Mechanical Properties Investigation of Lead-free Solder Sn99.3Cu0.7

Evaluation of A Double-Layer Anisotropic Conductive film (ACF) for Fine Pitch Chip-on-Glass (COG)

Structural Similarity as a Method to Reduce Qualification Tests

Effects of the Electric Field on Ni-induced Crystallization in FALC Process

Thermodynamic calculation-aided design Pb-free solders and related research

A Study of Thermosonic Gold Wire Bonding onto Silver Plated Copper Pad

Experimental and Numerical Investigation on Warpage of QFN Packages Induced during the Array Molding Process

Reliability of Ball Grid Array (BGA) Assembly with Reworkable Capillary Underfill Material

Finite Element Analysis of Thermo-hygro-mechanical Failure of a Flip Chip Package

Reflow Profile Simulation by Finite Element Method for a BGA Package

The Optimization Of Underfill Properties And Process Conditions for A Molded Flip-Chip SIP Package