会议专题

Solder Joint Failure Modes, Mechanisms, and Life Prediction Models of IC Packages under Board Level Drop Impact

国际会议

2005 6th International Conference on Electronics Packaging Technology(第六届电子封装国际会议)

深圳

英文

382-388

2005-08-30(万方平台首次上网日期,不代表论文的发表时间)