会议专题

2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

总文献量: 375篇会议类型: 国际会议会议地点: 桂林主办单位: 中国电子学会;中国半导体行业协会会议日期: 2012-08-13

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Wafer Bonding for CMOS Integration and Packaging

V.Dragoi F.Kurz T.Wagenleitner C.Fl(o)tgen G.Mittendorfer

Interfacial reaction of heat-sink during vacuum and reflow soldering in Space power electronics

Yarong Chen Meng Yang Binbin Zhang Rong An

Investigation on Surface Contamination caused by human on Phase Shifter Chip

Zhenzhen Rao Shengxiang Bao Jianhai Ye Zhang Xiaowen Wang Zuwen

Parameterized Modeling and Thermal Analysis of High-power LED package with GMSH and GetDP

Dai Weifeng Li Yuesheng Ru mao Zhou Yinyuan Li Shuzhi Ma Kejun

Comprehensive Analysis of Thermal Mechanical Stress induced by Cu TSV and its Impact on Device Performance

Chongshen Song Ran He Daquan Yu Lixi Wan

Design of One Novel LED Airport Runway Centerline Light Suitable for Various Applications

Chuangang Ji Mengxiong Zhao Tao Peng Fei Wang Cao Li Sheng Liu

Dynamic Analysis of Bare Printed Circuit Board under Impact

Ahmad H Youssef Xuejun Fan

Research on Thermal Field of Giant Magnetostrictive Jetting Dispenser

Pengfei Dan Can Zhou Shijun Zhang Guiling Deng

A combined fabrication methodology of the through wafer via for wl-package of GaAs image sensors

Jiaotuo Ye Shuangfu Wang Gaowei Xu Chunsheng Zhu Le Luo

Compliant Pin Interconnect Challenging and Reliability after RoHS Exemption

David He Yu Xiang DF Chung Paul Wang Livia Hu Bobby Dayal Karl Sauter Tim Norman Jorge Martinez_Vargas

Failure Mechanism Diagnosis on Plastic Package Integrated Circuit Basing on Fault Tree Analysis

Yuan Chen Xiaoqi He Ping Lai

Investigation on FBGA Block Warpage by Finite Element Simulation

Jinrui LI Lin TAN Qian WANG Jian CAI Guoliang YU Shuidi WANG Xiyun CHENG

Fabrication of YAG Glass Ceramic and Its Application for Light Emitting Diodes

Liang Yang Mingxiang Chen Shan Yu Zhicheng Lv Sheng Liu

Study on the electrodeposition of Fe-Ni UBM films in modified watts bath

Hao Zhang Li Zhang Zhenzhen Duan Chi-Ming Lai Zhi-Quan Liu

Wafer level packaging(WLP):fan-in,fan-out and three-dimensional integration

Xuejun Fan

A Study of Ultrasonic Bonding Flip Chip Process and its Reliability for Low Temperature Interconnection

Yo-Han Song Sang-woon Seo Gu-Sung Kim

Simulation of IMC Layer Growth and Cu Consumption in Sn-Ag-xCu/Cu Solder Joints during Reflow

Xiaohui Wang Mingliang Huang Fan Yang Ning Zhao

Key Failure Modes of Solder Joints on ENIG PCBs and Root Cause Analysis

Yao Bin Zou Yabing

Anodic bonding for Pyrex 7740 and nitride silicon for wafer level vacuum packaging

Minghai Xu Xuefang Wang Yuzhe Wang Chunlin Xu Chang Hu Sheng Liu

Reliability experiment of high power cm-bar arrays

Lu Guo-guang Lei Zhi-feng Huang Yun En Yun-fei