A Study of Ultrasonic Bonding Flip Chip Process and its Reliability for Low Temperature Interconnection
The purpose of studying is to confirm the reliability criteria of ultrasonic bonding with different chip size.To ensure this purpose,three kinds of specimens are prepared for compared evaluation,and bonding condition is secured by reliability assessment.For testing,chips are created with 5 mm × 5 mm,10mm × 10mm,and 15mm x 15mm.The bond interconnections between chip and substrate are designed more than fifteen points with different daisy chain.Substrates called PCBs also prepared to fit each chip.The ultrasonic bonding process is progressed to use the anisotropic conductive films (ACF).For comparing the bonding process,all specimens also progressed using thermo-compression bonding.Since then,temperature cycle (T/C) test of all coupons is performed during the 1000 cycle between -40℃ and 125℃.Stable connections are checked between chip’s I/O pads and PCBs land by the resistance measurement.And result of connected I/Os after T/C represent the term of connection ratio per coupon.Connections ratio were 70% with 5mm× 5mm coupons and 40% with 15mm× 15mm coupons.Therefore,smaller chip size show better reliable than bigger chip size during T/C test.
Yo-Han Song Sang-woon Seo Gu-Sung Kim
Kangnam University,Yongin 446-702,Korea EPworks Co.,Ltd,Seoul,139-743,Korea
国际会议
桂林
英文
1392-1394
2012-08-13（万方平台首次上网日期，不代表论文的发表时间）