会议专题

2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

总文献量: 375篇会议类型: 国际会议会议地点: 桂林主办单位: 中国电子学会;中国半导体行业协会会议日期: 2012-08-13

文章浏览

The Study of infrared radiation thermal imaging technology for temperature testing

Fang fang Song Xiaoqi He Ping Lai Ren wang

A highlight processing technology for SMT solder joint gray image

Liang Tianshou Zhou Dejian Liu Zhengwei

The effect of Voids on Thermal Conductivity of Solder Joints

Hailong Li Chunqing Wang Meng Yang Ningning Wang Rong An Yanjun Xu

Mechanism of Glass-Frit Fracture in MEMS Packaging

Hu Guojun

Assembly Technology by Multi-pin,HDF of PCB electrical connectors in Aerospace electronic products

Binbin Zhang Wei Zhang Meng Yang Yarong Chen

Synthesis of Multiferroic Ba0.7Sr0.3TiO3-Based Thin Films for Memory Devices by Chemical Solution Deposition

Bin Li Chunqing Wang Wei Liu Ying Zhong Zhixin Zhang

Carbon Aerogel/Polyaniline Composite as Supercapacitors Packaging Applications

Fengyin Chen Dayong Gui Sheng Ding Yifeng Zhu Jianhong Liu

Thermal characterization of high power LED array in Aluminum Base Copper Clad Laminate package

Chunjin Hang Jingming Fei Hong Wang Chunqing Wang

Study on the delamination between adhesive film and silicon in stacked-die packaging

Yinxing Liao Xiao Li Jun Wang

Ant-Algorithm-Annealing-Algorithm-based Optimization Approach for MCM Interconnect Test

Chen Lei

Design of RF MEMS phase shifter packaging based on through glass via(TGV)interposer

Xiaofeng Sun Yu Sun Jing Zhang Daquan Yu Lixi Wan

Phosphor Concentration in Silicone and Its Effect on the Mechanical and Interfacial Properties of Phosphor-Filled Silicone

Xing Chen Simin Wang Xiaogang Liu Sheng Liu

Molecular Dynamics Simulation of the Heat Transfer Coefficient at the Interface between CNTs and Water in the Carbon Nano-Tubes Micro-channel Cooler

Min Huang Gaoan Qi Xiaojing Wang Chunyang Zang Bing Wu Jia Wang

Oxidation and Corrosion of Au/Al and Cu/Al in Wire bonding Assembly

Teck Kheng Lee C.D Breach Wee Ling Chong Chwee Sim Goh

Determination of Driving Current of RGB LEDs for White Light Illumination

Huishan ZHAO S.W.Ricky Lee

Processing Performance and Microstructure of Sn-Zn Based Solders Modified by Bi and Mixed Rare Earth Elements

Jia-Qiang Huang Min-Bo Zhou Chang-Zheng Li Xiao Ma Xin-Ping Zhang

Analysis of Fatigue Life on Solder Joints of Compliant Wafer Level Packaging with MEMS Air-gap

Li Peng Pan Kai-lin Wang Shuang-ping

Wettability Transition of Nickel Films with Micro-Nano Cones Array

Wenyan Geng Haozhe Wang Anmin Hu Ming Li

Low temperature Al based wafer bonding using Sn as intermediate layer

Zhiyuan Zhu Min Yu Yingwei Zhu Peiquan Wang Chenchen Liu Wei Wang Min Miao Jing Chen Yufeng Jin

A Study of Novel Wafer Level LED Package Based on TSV Technology

Dong Chen Li Zhang Ye Xie KH Tan CM Lai