Simulation of IMC Layer Growth and Cu Consumption in Sn-Ag-xCu/Cu Solder Joints during Reflow

摘要：

　　A mathematical model that can well describe the kinetics of liquid/solid reaction between Sn-Ag-Cu solder balls and Cu substrates was developed in this study.The Cu consumption and the intermetallic compound (IMC) thickness as functions of reflow time for solder balls with different volumes and initial Cu concentrations were obtained from the model.Multiphysics finite element (FE) software was applied to solve the equations and visualize the numerical results.Furthermore,Sn-3.5Ag and Sn-3.0Ag-0.5Cu solder balls with different sizes (200,300,400,and 500 μm in diameter) were employed to react with Cu pads for various reflow times.The experimental measurements were compared with the simulated results and good consistency was obtained.

作者: Xiaohui Wang Mingliang Huang Fan Yang Ning Zhao

作者单位: Electronic Packaging Materials Laboratory,School of Materials Science & Engineering,Dalian University of Technology,Dalian,China,116024

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 823-827

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）