Interfacial reaction of heat-sink during vacuum and reflow soldering in Space power electronics

摘要：

　　The heat-sink interfacial reaction of Sn-90Pb、Sn-95Pb、Sn-37Pb solders are contrast with the Sn-3.0Ag-0.5Cu solder in vacuum soldering and reflow soldering in this paper,to find the matching solder combination.Results show that,Sn- 90Pb 、Sn-95Pb solders are not the good choices for Al2O3/MoCu in vacuum soldering.Sn-3.0Ag-0.5Cu and Sn- 37Pb solders can be used in the vacuum soldering,and Sn- 37Pb solder is the best choice as the leaded solders for space use.

作者: Yarong Chen Meng Yang Binbin Zhang Rong An

作者单位: Beijing spacecrafts,No.104,youyi road,haidian district,Beijing,China Harbin Institute of Technology No.104,youyi road,haidian district,Beijing,China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 186-188

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）