Parameterized Modeling and Thermal Analysis of High-power LED package with GMSH and GetDP

摘要：

　　We develop a method of parameterized modeling and FEM (Finite Element Method) analysis for high-power LED package with GetDP and GMSH.GMSH is applied on preprocessing and post-processing and GetDP works as a FEM solver.In our paper we show the Bottom-Up parameterized modeling method that is very useful for studying high-power LED package processes.A real high-power LED package is analyzed here and we can calculate the influence of geometrical factors on the processes interfaces.

关键词： High-Power LED Package Process FEM Thermal Analysis GetDP GMSH

作者: Dai Weifeng Li Yuesheng Ru mao Zhou Yinyuan Li Shuzhi Ma Kejun

作者单位: Department of Materials Science,Fudan University,Shanghai Research Center of Semiconductor Light Engineering and Technology,Shanghai

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 540-545

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）