The Study of infrared radiation thermal imaging technology for temperature testing

摘要：

　　Along with the infrared technical rapid development,infrared radiation (IR) infrared thermal image technology is widely applied in nondestructive testing.In this paper,the theoretical basis of IR thermal imaging technology and the method of emissivity and background correction are introduced.The thermal characteristic of one kind of packaging device was studied using infrared thermal imaging technology and FEM (Finite element method),for example,microwave module.Through the comparison and analysis of the infrared images of one type of microwave module at working condition,the junction temperature of electronic chips is obtained.

作者: Fang fang Song Xiaoqi He Ping Lai Ren wang

作者单位: Science and Technology on Reliability Physics and Application of Electronic Component Laboratory No. State 970 factory,Chengdu,610051,China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 1336-1339

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）