Design of RF MEMS phase shifter packaging based on through glass via(TGV)interposer

摘要：

　　Glass has good electrical,optical and mechanical properties as a substrate for SiP application.Through glass via (TGV) interposer technology can avoid complex fabrication processes and the using of expensive equipments comparing with through silicon via(TSV).In addition,it can lower the cost and enhance electrical performance as well as reliability of the electronic package.In this paper,a kind of TGV wafer with tungsten(W) vias is introduced and its RF performance is simulated.Using this kind of TGV interposer,a one-bit RF MEMS switched-line phase shifter and its package are designed.

作者: Xiaofeng Sun Yu Sun Jing Zhang Daquan Yu Lixi Wan

作者单位: Institute of Microelectronics,Chinese Academy of Sciences No.3,BeiTuCheng West Road,Chaoyang district,Beijing,100029,PR China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 808-810

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）