Analysis of Fatigue Life on Solder Joints of Compliant Wafer Level Packaging with MEMS Air-gap

摘要：

　　Based on current Compliant Wafer Level Package structure,a novel compliant structure with embedded MEMS air-gap is designed,Then,taking DDR DRAM chip as research object,3D finite element model is established by ANSYS software with designed bump structure.Analysis on stress-strain response of key fatigue failure solder joints under thermal loading condition is carried out.The thermal fatigue life of solder joints is estimated by Soloman low cycle thermal fatigue life expression.The results show that,the key position of fatigue failure locates at the furthest solder joints from the central point of the chip.Compared with other rigid bump structures and traditional compliant bump structure,thermal fatigue life of solder joints is enhanced significantly by adopting the embedded MEMS air-gap.

作者: Li Peng Pan Kai-lin Wang Shuang-ping

作者单位: Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology,Guilin University of Electronic Technology No.1 Jinji Road,Guilin,P.R.China,541004

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 755-759

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）