会议专题

Experimental Testing and Failure Prediction of PBGA Package Assemblies under 3-Point Bending Condition through Computational Stress Analysis

国际会议

第七届电子封装技术国际会议(2006 7th International Conference on Electronics Packaging Technology)

上海

英文

866-872

2006-08-26(万方平台首次上网日期,不代表论文的发表时间)