会议专题

2005 6th International Conference on Electronics Packaging Technology(第六届电子封装国际会议)

总文献量: 148篇会议类型: 国际会议会议地点: 深圳主办单位: 中国电子学会;中国半导体行业协会会议日期: 2005-08-30

文章浏览

Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint

A MCM Interconnect Test Generation Optimization Scheme Based on Ant Algorithm and Genetic Algorithm

Packaging Technology of Polymer/Si Arrayed Waveguide Grating and Their Environmental Stability

Lead-free Solders Based on the Sn-8Zn-3Bi Ternary Alloy with Additions of In, Nd or La

Detecting and Analyzing Wafer Bump Voids with X-Ray Inspection

Microstructure of AuSn Wafer Bonding for RF-MEMS Packaging

Study on Properties of High Reinforcement-Content Aluminum Matrix Composite for Electronic Packages

Design, Simulation and Measurement Techniques for Embedded Decoupling Capacitors in Multi-GHz Packages/PCBs

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