会议专题

Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint

国际会议

2005 6th International Conference on Electronics Packaging Technology(第六届电子封装国际会议)

深圳

英文

663-669

2005-08-30(万方平台首次上网日期,不代表论文的发表时间)