会议专题

2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

总文献量: 375篇会议类型: 国际会议会议地点: 桂林主办单位: 中国电子学会;中国半导体行业协会会议日期: 2012-08-13

文章浏览

Investigation for the Response of PCB Assembly with Five POP Packages during Dropping

Yu Peng Fan Zerui Yao Xiaohu

Development of Flexible Cu-MWCT Composite Thin Film for Functional Applications

R.Manu

TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder

Manman Rui Xiuzhen Lu Si Chen Lilei Ye Johan Liu

Modeling of Delamination in IC Packages

Andrew A.O.Tay

Size effect of BaTiO3 on the properties of epoxy/BaTiO3 composite film

Suibin Luo Shuhui Yu Rong Sun Xianwen Liang Maobai Lai

Suppressing effect of 1 wt.% nano-TiO2 addition into low Ag content Sn-Ag-Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

L.C.Tsao W.T.Huang M.W.Wu Sheng-Lung Su

Robustness of Point Light Source Approximation in Lens Design for Light-Emitting Diode Packages

Run Hu Zhili Zhao Sheng Liu Xiaobing Luo

Failure Analysis of Assembly Defect with IR-OBIRCH from Backside

Li Tian Miao Wu Chunlei Wu Diwei Fan Gaojie Wen Dong Wang

Millimeter-wave Performance of Various Interconnections Used for Si-based IC Packaging Technologies

Jie Cui Qidong Wang Guidotti.Daniel Liqiang Cao Lixi Wan

A Steel Pressure Sensor Based on Micro-fused Glass Frit Technology

Zongyang Zhang Xingguo Cheng Xulong Gui Xiaojie Chen Sheng Liu

Application of Finite Element Simulation on Package Failure Analysis and Problem Solving

Weidong Huang

Influences of the Initial Thickness of the Interfacial IMC Layer on Electromigration Behavior of Cu/Sn/Cu Microscale Joints

Wu Yue Hong-Bo Qin Min-Bo Zhou Guang-Sui Xu Shan-Shan Cao Xiao Ma Xin-Ping Zhang

Heat Dissipation Using Nanotechnology Based Materials and Processes

Johan Liu

Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler

Yan Zhang Hui-feng Lv Jing-yu Fan Di Jiang Johan Liu

Microstructure Evolution of 1100 Al Alloy Multi-foils during Ultrasonic Additive Manufacturing

Hongjun Ji Junzhao Wang Mingyu Li

Research on LED Temperature Characteristic and Thermal Analysis at Low Temperatures

Yu Guo Kai-lin Pan Guo-tao Ren Shu-jing Chen Fei Yuan

Trends of Analog and Power Electronic Packaging

Yong Liu

A Novel LED Un-symmetrical Lens for Road Lighting with Super Energy Saving

Zhili Zhao Run Hu Kai Wang Fei Chen Shang Wang Sheng Liu

The Effect of Different TSV Electroplating Levelers on the Copper Residual Stress

Ciyan Wu Xue Feng Haiyong Cao Huiqin Ling Ming Li Dali Mao

A Thick Film Accelerometer based on LTCC-Technology

Shichao Guo Min Miao Runiu Fang Duwei Hu Yufeng Jin