TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder
As the development of micro-systems moves towards higher speed and miniaturization,the requirement for interconnection density increases significantly.However,the use of conventional solders will be limited as the increasing I/O density lowers the pitches to very small size.Recently,there have been great developments in nano-composite solders.This paper investigated the influence of nano-titanium dioxide (TiO2) of 99.9% purity on the wettability,micro-structural,melting and mechanical properties of Sn/3.0Ag/0.5Cu.The composite solder was prepared by mechanically mixing solder paste with TiO2 nanoparticles for 30 minutes.The TiO2 nanoparticles,with average diameter of 10 nm,were manufactured by precipitation.The solder paste was SAC305 Type 4.After reflow soldering the wetting angle was measured.The microstructure of the composite solders and TiO2 was studied by means of scanning electron microscope (SEM).An optical microscope (OM) was employed to observe the fracture mode after shear test.A pull test was performed to investigate the shear strength of all samples with composite solders between two PCBs with Sn coating,both before and after thermal cycling (TC) with range between -40℃ and 85℃.Differential scanning caborimetry (DSC) was adopted to analyze the melting point of composite solders.The results indicate that when the TiO2 content increased from 0.5% to 2%,the wettability of the solder improved,which resulted in higher shear strength and better mechanical behavior.
Manman Rui Xiuzhen Lu Si Chen Lilei Ye Johan Liu
Key State Laboratory for New Displays & System Applications and SMIT Center,Shanghai University,Box Key State Laboratory for New Displays & System Applications and SMIT Center,Shanghai University,Box SHT Smart High Tech AB,Fysikgr(a)nd 3,41296 Gothenburg,SWEDEN
国际会议
桂林
英文
203-207
2012-08-13（万方平台首次上网日期，不代表论文的发表时间）