Development of Flexible Cu-MWCT Composite Thin Film for Functional Applications

摘要：

　　Flexible films of Cu–MCNT composites were fabricated by electrodeposition from an optimized copper bath.The substrate used is polythene film that was predeposited with electroless copper as a seed layer for conduction.An optimized amount of CNT was incorporated into copper bath and the deposition was done at quiescent and agitation condition.The adhesion of the seed layer and the upper electrodeposited composite layer was good as revealed from bend test.The electrical as well as physicalmechanical property of the film was improved with respect to applied condition.The topography and the texture of the metal-CNT deposit were characterized with respect to various analyses.

作者: R.Manu

作者单位: Electroplating Metal Finishing Technology Division Central Electrochemical Research Institute,Karaikudi,Tamilnadu-630006,INDIA

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 442-446

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）