Suppressing effect of 1 wt.% nano-TiO2 addition into low Ag content Sn-Ag-Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

摘要：

　　This study investigated the effects of adding 1 wt.% nano- TiO2 particles into low-Ag content Sn0.35Ag0.7Cu (SAC) lead-free solder alloys on the growth of intermetallic compounds (IMC) with Cu substrates during solid-state isothermal aging at temperatures of 125,150,and 175 ℃ for up to 7 days.The results indicate that the morphology of the Cu6Sn5 phase transformed from scallop-type to layer-type in low-Ag SAC composite solder/Cu joints.The growth rate of these IMCs increased with the aging temperature and time.Kinetics analyses showed that growth of the overall IMC layers was diffusion controlled.The apparent activation energies for the growth of overall IMC layers are calculated to be 50.62 kJ/mol.

作者: L.C.Tsao W.T.Huang M.W.Wu Sheng-Lung Su

作者单位: Graduate institute of Materials Engineering,National Pingtung University of Science&Technology,91201 Department of Mechanical Engineering,National Pingtung University of Science &Technology,91201,Neipu Department of Materials Science & Engineering,National Formosa University,Taiwan,China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 465-468

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）