Modeling of Delamination in IC Packages

摘要：

　　When plastic-encapsulated packages undergo solder reflow after being subjected to moisture preconditioning,hygrothermal stresses are induced in the package.If these stresses are excessive popcorning failure will occur.It has been shown that popcorning failure is usually preceeded by delamination of interfaces in the package.The fracture mechanics approach has been successfully applied by the author to analyse 2D and 3D delaminations in plasticencapsulated IC packages.In this paper,the author will review some case studies and key findings.

作者: Andrew A.O.Tay

作者单位: Department of Mechanical Engineering,National University of Singapore

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 854-860

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）