会议专题

2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

总文献量: 268篇会议类型: 国际会议会议地点: 北京主办单位: 中国电子学会;中国半导体行业协会会议日期: 2009-08-10

文章浏览

Multiscale Delamination Modeling of an Anisotropic Conductive Adhesive Interconnect Based on Micropolar Theory and Cohesive Zone Model

Yan Zhang Jing-yu Fan Johan Liu

Through-Silicon Via Filling Process Using Pulse Reversal Plating

Xinxin Yang Huiqin Ling Dongyan Ding Ming Li Xianxian Yu Dali Mao

Numerical Simulation on Heat Pipe for High Power LED Multi-Chip Module Packaging

Dongmei Li G.Q Zhang Kailin Pan Xiaosong Ma Lei Liu Jinxue Cao

Advanced Package Design for Electronic and MEMS Applications Supported by FE Analyses and Deformation Measurements

Sommer, J.-P. Michel, B. Kugler, A. Rank, H.

Developing on IC Flip Chip Bonder Machine & Process

JIAN GUO

Lifetime Prediction of an IGBT Power Electronics Module under Cyclic Temperature Loading Conditions

Hua Lu Chris Bailey

Miniaturized Printed Wire Antenna in Package for 2.4GHz Wireless Communications

Xiaoli Liu Yunfeng Wang Lei Li Lixi Wan

Shock Performance Study of Solder Joints in Wafer Level Packages

Amarinder Singh Ranouta Xuejun Fan Qiang Han

Solder Joints Reliability with Different Cu Plating Current Density in Wafer Level Chip Scale Packaging (WLCSP)

Kenny Cao KH Tan CM Lai Li Zhang

The Principal Component Analysis of Cu Stud Bump Shaping Process Parameters

Wei Mu Zhaohua Wu Chunyue Huang

Study on Microstructure and Properties of Al/SiCp Electronic Packaging Materials Embedded Metal Components

Zhiqing Zhang Hongyu Zheng

Nanoscale Mechanical Properties and Microstructure of 3D LTCC Substrate

Yang-Fei Zhang Jia-Qi Chen Shu-Lin Bai Min Miao Jing Zhang Fang-Qing Mu Zheng-Yi Wang Shao-Jun Xia Yu-Feng Jin

A Study on the Characterization of Quasi-Three-Dimensional PN Junction Capacitor

Huijuan Wang Yao Lv Wei Gao Lixi Wan

Analysis the Performance of the Micro-Channels Cooler with Different Inlet Position

Xiaojing Wang Wen Zhang Hongjun Liu Ling Chen Zongshuo Li

A Method to Produce Printed Circuit Boards with Embedded Semiconductors Using Stress Buffer Layers

Won Seo Young-Mo Koo Se-Hoon Park Nam-Ki Kang Gu-Sung Kim

Effect of Miniaturization on the Microstructure and Mechanical Property of Solder Joints

Bo Wang Fengshun Wu Jin Peng Hui Liu Yiping Wu Yuebo Fang

Assessment of LF Solder Joint Reliability by Four Point Cyclic Bending

Jifan Wang Yuming Ye Junying Zhao Sang Liu Yunhua Tu Song Li Zhiwei Song

Controlled Synthesis of Ortho-Substitution Ortho-cresol Novolac Resins

Xiaowei Tian Zhenguo Yang Jiang-Yan Sun Zheng Ji Chuang Jiang

Design of Miniaturized Bandpass Filters for GSM and GPS Applications Using Embedded Capacitor Material

Yunfeng Wang Lei Li Lixi Wan

Depiction of the Elastic Anisotropy of AuSn4 and AuSn2 from First-principles Calculations

Rong An Chunqing Wang Yanhong Tian