Assessment of LF Solder Joint Reliability by Four Point Cyclic Bending

摘要：

Quick and effective reliability assessment method is one of aspired targets for product development and test. Base on specific design board, this paper study the effect of four-point cyclic bend test parameters, such as deflection and temperature to lead-free solder joint fatigue life and failure mode, compare the performance of lead-free joints in fourpoint cyclic bend and accelerated temperature cycling (ATC), explore the application of four-point cyclic bend test method in lead-free solder joint reliability assessment.

作者: Jifan Wang Yuming Ye Junying Zhao Sang Liu Yunhua Tu Song Li Zhiwei Song

作者单位: Huawei Technologies Co., LTD.Shenzhen, Guangdong, P.R.China Huawei Technologies Co., LTD. Shenzhen, Guangdong, P.R.China

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 572-576

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）