Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers
Heat spreader with aligned CNTs designed for thermal management of HB-LED packaging and microelectronic packaging
A MCM Interconnect Test Generation Approach using Ant Colony Algorithm with Crossover and Mutation Operator
A Computationally Efficient Model for Analyzing An Electro-Statically Driven MEMS Device Embedded in A Dielectric Fluid