会议专题

第七届电子封装技术国际会议（2006 7th International Conference on Electronics Packaging Technology）

总文献量: 200篇会议类型: 国际会议会议地点: 上海主办单位: 中国电子学会;中国半导体行业协会会议日期: 2006-08-26

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Development on Semiconductor Packaging and Testing Industry in China

Thin Film Interfacial Strength Characterization using Mixed Mode Bending

Design and the Trends of Microsystem Packaging

Intermediate Bus Voltage Optimization for High Voltage Input VRM

Plastic-Silicon Bonding for MEMS Packaging Application

Cu/M/Cu sub-mount applied in high brightness LED array package

The Design and Realization of Machine Vision System in Flip-chip Bonder

The Research status of Stress and Failure Analysis in Ceramic Packaging

Effect of interfacial IMCs Proportion on the Reliability of Miniature Lead-Free Solder Joint

The Effect of Mounting Stress on the Zero Point Output of Pressure Sensors

Fully Cure-Dependent Modeling and Characterization of EMCs with Application to Package Warpage Simulation

Design Of A Vibration-Sensitive Electronics Module With Glass-Filled Plastics

Evolution of Intermetallic Compounds in PBGA Sn-Ag-Cu Solder Joints during Thermal Cycling Testing

Effects of Alloying Elements on the High-temperature Oxidation Resistance and Wettability of the Sn-9Zn Alloy

Simulation and Analysis for Lead frame bending Impact to Assembly Singulation Process

MEMS patch antenna of synthesize substrate design for WCDMA system

A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor

The Reliability of A Cantilever with A Touched Tip in Shock Environments

FEA Simulation and In-situ Warpage Monitoring of Laminated Package Molded with Green EMC Using Shadow Morie System

Heterogeneous Integration: The Bridge between Micro/Nanoelectronics and Application

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