Enhanced Thermal Measurements of High Power LEDs by Junction Characteristic

摘要：

The measurements of junction temperature rise and thermal resistance of power LEDs by junction characteristic are proposed in this paper. The measured thermal resistance is corrected by the light-absorbing method. It is also proved that the physical meaning of the electrical average temperature rise of series LED array system is the arithmetic mean of the temperature rise of all sub-LEDs in the system. Therefore, a novel method to extract the temperature distribution of series LED systems is presented.

作者: Chenning Ge Shiwei Feng Guangchen Zhang Kaikai Ding Peifeng Hu Haitao Deng

作者单位: School of Electronic Information & Control Engineering,Beijing University of Technology, Beijing, China

会议类型: 国际会议

会议名称: 2010 International Workshop on Junction Technology(2010国际结技术学术研讨会 IWJT 2010)

会议地点: 上海

会议语种:英文

页码: 1-4

在线出版日期: 2010-05-10（万方平台首次上网日期，不代表论文的发表时间）