Void Free Soldering with Vacuum
Shrinking package sizes of electronic devices require a perfect thermal management thus, void free soldering. Voids reduce the electrical and thermal conductivity and cause hot spots. In addition, lead free solder escalates the formation of voids. The only reliable method available to remove voids from the liquid solder is the use of vacuum. The patented inline soldering system with vacuum VADU by PINK eliminates voids. Heating and cooling is based on contact heat transfer. The temperature gradients are adjustable by distance regulation between the heating plate and the substrate. A controlled application of vacuum during the preheating improves the heating process by possible reduction of spluttering. Vacuum applied in the liquid phase of the solder, removes voids to zero, respectively to below 1 ％. Any product, independent from its thermal mass, can be soldered void free, with temperature profiles according to customers specifications, or IPC/JEDEC recommendations.
Void free soldering vacuum soldering inline vacuum soldering, zero defect manufacturing
Dipl.-lng.Klaus Roemer
PINK GmbH Vakuumtechnik Am Kessler 6, DE-97877 Wertheim / Germany
国际会议
Chinas Premier SMT & MPT Event(2007年中国国际表面贴装和微组装技术大会)
上海
英文
70-73
2007-03-22（万方平台首次上网日期，不代表论文的发表时间）