Flat Bump Package

摘要：

Consumer market and new applications worldwide have demanded the semiconductor package to be designed smaller in size, better performance and more reliable. FBP, developed by JCET, not only meets the requirements but excels the performance of several existing packaging technologies in comparison. In this paper, the special structure and excellent performance of FBP are introduced, described and illustrated graphically.

作者: Liang Zhizhong Tao Yujuan

作者单位: Jiangsu Changjiang Electronics Technology Co., Ltd., Jiangyin Jiangsu 214431, China

会议类型: 国际会议

会议名称: Chinas Premier SMT & MPT Event(2007年中国国际表面贴装和微组装技术大会)

会议地点: 上海

会议语种:英文

页码: 163-169

在线出版日期: 2007-03-22（万方平台首次上网日期，不代表论文的发表时间）