Experimental and Numerical Reliability Analyses of Electronic Packaging Materials
Most electronic products are moving towards higher miniaturization and higher performance, leading to increased circuit density and extremely high demands on reliability. Microelectronic product failures in micro- and nano system can be traced back to thermal, mechanical, chemical, and electrical origins or combination thereof. Typical failures are cracks, delamination, buckling, warpage, popcorning, stresses, voiding, fatigue, thermomigration and electromigration. Therefore, the development of new electronic products in different areas of microelectronics applications (automotive industry, airbase industry or consumer electronics) requires careful investigation of material properties on the micro and nano scale 1. A combination of analytical methods of finite-element- (FE) simulation and experiment should be capable of describing the failure mechanisms and of making accurate and physically motivated life time prediction models for use on a wide scale. Most of the materials data from existing data sheets cannot be used for these simulations. Furthermore, properties of small amounts of materials can differ significantly from bulk materials. Thin materials show a complex structure and materials behaviour due to different mechanical and thermal properties within a sandwich, which can also influence the mechanical and thermal reliability, and hence the life time. In addition, it is known that physical properties of materials can change significantly, when the dimensions of specimens become very small (Asize-effect@). Therefore, the material properties cannot be deduced from data obtained from macro-specimens. Consequently, it is frequently required to determine mechanical and thermal properties of these materials in their actual dimensions, and their properties have to be measured directly at the components. For this purpose, the advanced deformation measurement methods discussed here are needed.
Thermo mechanical tests size effects fracture moisture reliability
Hans Walter Bernd Michel
Fraunhofer Institute Reliability and Microintegration (IZM),Micro Materials Center Berlin and Chemnitz Gustav-Meyer-AHee 25, D-13355 Berlin, Germany
国际会议
Chinas Premier SMT & MPT Event(2007年中国国际表面贴装和微组装技术大会)
上海
英文
192-202
2007-03-22(万方平台首次上网日期,不代表论文的发表时间)