会议专题

2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

总文献量: 271篇会议类型: 国际会议会议地点: 上海主办单位: 中国电子学会;中国半导体行业协会;上海大学会议日期: 2011-08-08

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Towards Quantitative Microstructural Modeling for 3D Electronic Packaging

Zhiyong Wu Zhiheng Huang

Study on the Adhesion Strength of New Nano-structured Polymer-Metal Composite for Thermal Interface Material (Nano-TIM) under Different Pressures

Lei Zhang Xiuzhen Lu Xin Luo Bjom Carlberg Masoud Zandira Lilei Ye Johan Liu

Self-Assembly of Three-Dimensional Microstructures in MEMS via Fluxless Laser Reflow Soldering

Lei Yang Wei Liu Chunqing Wang Yanhong Tian

Three Years of Fine Cu Wire Bonding in High Volume Manufacturing

Bernd K.Appelt Louie Huang Yi-Shao Lai Scott Chen

Investigation of Palladium Coverage on Bonded Balls of Palladium-Coated Copper Wires

Wei Koh Teck-Kheng Lee Hun-Shen Ng Kay-Soon Goh Hong-Meng Ho

A Stress-related Model for Reliability Lifetime Estimation of ACA Joints Based on Accelerated Failure Date

Guanghua Wu Bo Tao

A Novel Design of Handling System for Silicon Wafer Thinning

Cao Li Shengjun Zhou Chang Hu Xuefang Wang Sheng Liu

Freeform Lens Design for Uniform Illumination with Extended Source

Dan Wu Kai Wang Sheng Liu

Effect of the Amount of Phosphor Silicone Gel on Optical Property of White Light-emitting Diodes Packaging

Run Hu Xiaobing Luo Sheng Liu

Corrosion Behavior of 64Sn-35Bi-1Ag Solder Doped with Zn in NaCl Solution and its Electrochemical Migration Characteristics in High Humid Thermal Condition for Electronic Packaging

L.Hua J.S.Zhang

Development Process of Phosphor Coating with Screen Printing for White LED Packaging

Shan Yu Liang Yang Cao Bin Huai Zheng Mingxiang Chen Sheng Liu