Towards Quantitative Microstructural Modeling for 3D Electronic Packaging
With the electronic packaging technologies entering the 3D era, researches are needed to associate the microstructures with reliability and accurately predict the performance of solder joints/interconnects. It has been demonstrated that both the size and geometry have an impact on the microstructural formations within solder bumps. More detailed researches are required to study this size and geometry effect quantitatively in order to secure the reliability of ultrafine interconnects for the next generation electronic products. In this paper, morphologies of dendrites within solder bumps with different sizes and geometries are simulated using a phase field method. The results indicate that the size and geometry effects on the microstructural formation are not evident for the cases investigated in the present study. However, the variations in sizes and geometries of solder bumps are not substantial due to the scale that a phase field model can deal with. In addition, mass diffusion, which is the primary source accounting for the size and geometry effect has not yet coupled with the phase field equations. Although the process of heat transfer via convection, which has been considered in the present model, shares a similar mechanism with mass diffusion, the solidification of highly undercooled melt proceeds so fast that the convective cooling effect is negligible. This paper also examines numerical errors on simulated microstructures from the phase field model. The numerical errors are found to have a significant effect on the microstructures from simulations and thus have to be carefully controlled in order to achieve quantitative microstructural modeling.
Zhiyong Wu Zhiheng Huang
School of Physics and Engineering, Sun Yat-sen University, 135 West Xingang Road, Guangzhou 510275, China
国际会议
上海
英文
268-274
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）