Critical Design Factors Analysis to the Reliability of High Aspect Ratio PTH

摘要：

With the integration enhancement of electronic product, via-holes now are becoming more and smaller; on the other hand, the thickness of boards is increasing continually, so we have to care more about thermal fatigue reliability of high aspect ratio PTH (Plated through Hole). This paper focuses on high aspect ratio PTH which is about 10:1 to present the process and result of reliability testing , and some typical fatigue analysis are introduced too, then based on these it explains some critical design factors to affect the reliability of high aspect ratio PTH.

关键词： PTH HATS

作者: Zhang Yuan

作者单位: HUAWEI TECHNOLOGIES CO., LTD MANUFACTURE TECHNOLOGIES DEPARTMENT

会议类型: 国际会议

会议名称: Chinas Premier SMT & MPT Event(2007年中国国际表面贴装和微组装技术大会)

会议地点: 上海

会议语种:英文

页码: 220-231

在线出版日期: 2007-03-22（万方平台首次上网日期，不代表论文的发表时间）