会议专题

Evaluation of Fracture Characteristic of DLC Films on Silicon Deposited by RF-PACVD Using Nano-indentation Fracture

国际会议

Proceeding of the First International Conference on Precision Engineering and Micro/Nano Technology in Asia(第一届亚洲精密工程与微/纳米技术国际学术会议)

深圳

英文

360-364

2005-11-12(万方平台首次上网日期,不代表论文的发表时间)