A Method of Improving Signal Integrity of Solder Joints
Solder joints are a common electrical connection in the RF circuit, and the characteristic impedance discontinuity of solder joints increases the energy loss of the signal in the circuit.In this paper, the solder joints of the RF connector and microstrip line component were investigated.Using transmission line theory, the reasons for the characteristic impedance discontinuity of the solder joint were discussed, and the compensation schemes were proposed.Based on the actual structure of the component, a 3D electromagnetic field model was established to evaluate transmission loss and signal reflection.In the simulation, time-domain reflectometry (TDR) was used to evaluate the characteristic impedance of solder joints.Finally, the experiments were completed.The electromagnetic field model results are in good agreements with experimental results, which indicate that the compensation scheme has an obvious effect on the impedance compensation of solder joints.
Solder joint Impedance discontinuity Anti-pad Compensation
Kaixuan Song Jinchun Gao Ziren Wang Babar Ali Hafiz Muhammad Bilal Gang Xie
Beijing University of Posts and Telecommunications, Beijing 100876, China
国际会议
江苏苏州
英文
244-247
2019-11-04（万方平台首次上网日期，不代表论文的发表时间）